MINISYMPOSIA AND WORKSHOPS
The following minisymposia and workshops will be organized during the 28th KomPlasTech Conference:
The modern industries are going towards Industry 4.0, where the concept of artificial intelligence (AI) and machine learning (ML) along with Internet of Things, Robotic and Machine Vision, are getting more and more importance in the manufacturing sector. In case of materials modelling, optimization, and design also, machine learning and evolutionary algorithms are finding their application areas in the domain of materials engineering ardently. The mini symposium will focus on applications of machine learning and evolutionary algorithms along with other artificial intelligence tools in the areas of materials design, metallurgical process modelling and optimization, performance enhancement of the product, and all types of manufacturing processes. Computing tools applied in the materials domain will include, but not limited to, genetic algorithm, swarm intelligence, genetic programming, neural network, fuzzy logic, rough set, support vector machine and all other techniques that fall within the purview of artificial intelligence and machine learning. The concept of data analytics and data driven design towards innovation of materials and processes are also welcome.
Long products manufacturing includes many processes which influences final product quality e.g. heating, multi-stage rolling, cooling or straightening. Proper design of processes’ parameters is crucial to obtain expected product properties. This is often realized by application of advanced numerical simulations integrated with optimization methods or sensitivity analysis. All the works related to these subjects are kindly invited. However, the topics of this minisymposium cover also infrastructural aspect like usage of high performance computing, cyber-physical systems and applications of advanced numerical simulations in industrial practice, usage of cloud computing and other modern infrastructures for purposes of design of industrial processes. Additionally, presentations related to advances in numerical simulations methods are welcome, including methods in meshing, solvers or metamodels.